There is some intriguing information about Lunar Lake, Intel’s upcoming processors. According to leaked slides, it appears that Intel has decided to outsource the production of Lunar Lake’s Compute Tile to TSMC, using their advanced 3nmN3B manufacturing process. This marks a significant change for Intel, which traditionally produced high-performance x86 chips in-house. Lunar Lake MX will feature processors with up to 8 cores, divided into 4 high-performance Lion Cove units and 4 high-efficiency Skymont units. They also boast a powerful Xe2 GPU with 8 clusters, an artificial intelligence-focused NPU 4.0, and power efficiency ranging from 17W to 30W, with the option of dropping to 8W for fanless designs. Lunar Lake will adopt a multichiplet design and use Foveros 3D packaging, with CPU, GPU, and memory controller housed in the same chiplet. To further reduce the footprint, the processors will be equipped with LPDDR5X-8533 RAM directly on the package. Although rumors suggest the use of TSMC’s 3nm process for the Compute Tile, official statements from Intel indicate that Lunar Lake will be produced with Intel’s 18A node. However, there is still uncertainty and we will have to wait for official information. Stay tuned for the latest updates on Lunar Lake and Intel’s strategies.
